Jung Soo Lee, Ph.D., M.B.A.
Process Engineer – BEOL/Packaging Specialist
Phoenix, Arizona
jungsoolee8619@email.com
Professional Summary
5+ years of industry experience in semiconductor manufacturing with Ph.D. in Applied Science, M.S. in Mechanical Engineering, and MBA. Specialized in BEOL (Back-End-Of-Line) and advanced packaging processes with expertise in thin-film engineering, process integration, and yield optimization. Proven track record as a leading process engineer for critical projects including 3D-DRAM metalization and advanced sensor development. Excellent communicator with strong technical depth and adaptability in fast-paced semiconductor environments.
Professional Experience
Yield Engineering Systems, Inc. (YES) – Chandler, AZ
Process Engineer – Key Account Technologist
Dec. 2025 – Current
- Technologist for surface finishing and reflow tools: fluxless reflow, vertical furnace, and ENEPIG
- Customer support on yield monitoring with responsive technical support
ASM America, Inc. – Phoenix, AZ
Sr. Process Engineer – R&D
Apr. 2024 – Oct. 2025
- Leading PE for BEOL integration of Molybdenum ALD film applied to 3D-DRAM wordline metalization
- Leading PE for developing in-situ laser sensor for Molybdenum dose analyzer
- Leading PE for matching processes of decades of on-site and demo equipment
- Equipment maintenance: monitoring performance through wafer defect measurement
Sr. Process Engineer – Metrology
May 2022 – Apr. 2024
- Owner of transmission electron microscopy (TEM) operations
- Internal and external customer care focusing on critical interests
- Material STEM analysis: S/TEM, EDS, EELS, 4-D STEM, strain analysis, image analysis
- Active collaboration with internal customers: paper publication for low-temp selective epitaxy development
INanoBio, Inc. – Scottsdale, AZ
Postdoctoral Researcher
Apr. 2021 – Apr. 2022
- Thin-film deposition on next-gen DNA sequencing device using CVD and ALD
- Device failure analysis using S/TEM and FIB/SEM dual beam at ASU facility
Education
Quantic School of Business & Technology – Washington, D.C.
Master of Business Administration (MBA)
Apr. 2023 – Aug. 2024
- Online Class of 2024 | Score: 91%
- Continuing study of MBA aligned with new trends in tech business
Southern Methodist University – Dallas, TX
Ph.D. in Applied Science
May 2018 – Jan. 2021
- GPA: 3.96/4.0
- Engineering core: thin-film engineering, microfluidics, nanofabrication
Southern Methodist University – Dallas, TX
M.Sc. in Mechanical Engineering
Aug. 2016 – May 2018
- GPA: 3.425/4.0
- Engineering core: fluid dynamics, nanofabrication
Yonsei University – Seoul, South Korea
B.Sc in Engineering (공학사, 工学士)
2006 – 2013
- Leave of absence during 2008 – 2010 for mandatory military service in the Republic of Korea (ROK)
- Honor student with top academic performance (2012)
Licenses & Certifications
Advanced Semiconductor Packaging
Arizona State University • Dec. 2025
Advanced semiconductor packaging technologies and manufacturing processes.
[View Credential]Semiconductor Packaging Manufacturing
Arizona State University • Dec. 2025
Packaging manufacturing flow, reliability, and production methodologies.
[View Credential]Introduction to Semiconductor Packaging
Arizona State University • Dec. 2025
Semiconductor packaging fundamentals and advanced integration concepts.
[View Credential]Fundamentals of Semiconductor Characterization
Arizona State University • Dec. 2025
Electrical and physical characterization techniques for semiconductor materials.
[View Credential]Electrical Characterization: Diodes
Arizona State University • Dec. 2025
Diode electrical behavior, semiconductor testing, and device analysis.
[View Credential]Primary and Secondary Batteries
Arizona State University • Jan. 2026
Battery fundamentals, electrochemistry, and energy storage technologies.
[View Credential]Introduction to Semiconductor Process 1
KAIST • Nov. 2025
Semiconductor process fundamentals including deposition and fabrication flow.
[View Credential]Introduction to Semiconductor Process 2
KAIST • Nov. 2025
Semiconductor process fundamentals including deposition and fabrication flow.
[View Credential]Selected Publications
Author/co-author of 11+ peer-reviewed journal articles and conference papers in nanotechnology, nanopore sensing, semiconductor materials, and advanced characterization.
Detection of nucleotides in hydrated ssDNA via 2-D h-BN nanopore
Electrophoresis (Wiley), 2021
- First author publication
- Selected for journal cover
- First demonstration of consecutive nucleoside detection using 2-D nanopore
- Nanopore sensing and nano-fluidic systems research
Stiffness measurement of nanosized liposomes
Electrophoresis (Wiley), 2019
- First author publication
- Selected for journal cover
- Stiffness measurement using automated nanopore recapturing platform
Mechanical characterization of HIV-1
Electrophoresis (Wiley), 2019
- Selected for journal cover
- First demonstration of HIV-1 maturity characterization using nanopore recapturing technique
Multiple consecutive recapture of rigid nanoparticles
Electrophoresis (Wiley), 2017
- First author publication
- Selected for journal cover
- First demonstration of automated nanopore recapturing platform
Core Competencies
Process Engineering: BEOL integration, thin-film process engineering, Molybdenum ALD, 3D-DRAM metalization, selective growth
Advanced Packaging Equipment: Fluxless formic acid reflow, ENEPIG PCB plating, vertical furnace, surface finishing tools
Metrology & Analysis: Transmission Electron Microscopy (TEM), STEM, SEM, XRR/XRD, XRF, AFM, ellipsometry, 4D-STEM, strain analysis
Data Analysis: JMP (JSL), Excel, MATLAB, statistical process control, process drift analysis, tool-to-tool matching, root-cause correlation
Optics & Instrumentation: Diode laser alignment, Fourier optics, free-space and fiber coupling, optical table components
Soft Skills: Technical leadership, cross-functional collaboration, customer support, excellent communicator, strong problem solver
Honors & Recognition
- Journal Citations: 286+ citations in peer-reviewed publications (May 2026)
- First/Key Author: 11+ published journal articles and conference papers
- Patent Holder: South Korea Patent KR-10-2016-0058046 (2017)
- Honor Student: Top grades at Yonsei University, Seoul, South Korea (2012)
Get in Touch
I'm open to discussing semiconductor process engineering opportunities,
collaboration on advanced materials projects, and technical consulting.
Email: jungsoolee8619@email.com
Location: Phoenix, Arizona
GitHub: github.com/jungsoolee8619